ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,037, issued on Aug. 4, was assigned to Yamaha Robotics Co. Ltd. (Tokyo). "Bonding apparatus, bonding method, and computer readable storage m... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,038, issued on Aug. 4, was assigned to ASMPT Singapore Pte. Ltd. (Singapore). "System and method for fluxless thermocompression bonding" was... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,039, issued on Aug. 4, was assigned to SHARP DISPLAY TECHNOLOGY Corp. (Kameyama City, Japan). "Method of producing micro-LED panel" was inve... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,040, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Low temperature substrate bonding... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,042, issued on Aug. 4, was assigned to Intel Corp. (Santa Clara, Calif.). "Bumps comprising tin, cooper and bismuth for liquid metal socket ... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,043, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "High-density microbump arrays with en... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,044, issued on Aug. 4, was assigned to Intel Corp. (Santa Clara, Calif.). "Substrate trench for improved hybrid bonding" was invented by Zhi... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,045, issued on Aug. 4, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China). "Package structure and method for manufacturing sam... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,046, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and NATIONAL TAIWAN UNIVERSITY (Taip... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,047, issued on Aug. 4. "Curable resin film, film material for semiconductor device production, curable resin composition for semiconductor d... Read More